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Soldering

  1. 1.

    Heat stress during soldering will greatly influence the reliability of LEDs, however that effect will vary on heating method.
    Also, if components of varying shape are soldered together, it is recommended to set the soldering pad temperature according to the component most vulnerable to heat (eg. surface mount type device).
    (Recommended condition : Soldering pad temperature > Package temperature)

  2. 2.

    Because LED parts including the epoxy are not stable immediately after soldering (when they are not at room temperature), any mechanical stress may cause damage to the product.
    Please avoid such stress after soldering, especially stacking of the boards which may cause the boards to warp and any other types of friction with hard materials.

  3. 3.

    During the soldering process with a soldering pad, if the pad has just been cleaned, please make sure the pad reaches appropriate temperature before resuming the solder process.
    Also, please avoid pressure which could dislocate the components until the solder is cool and hard, as it may influence solder performance and quality.

Soldering Surface Mount Type Device

  1. 1.

    Recommended temperature profile for the Reflow soldering is listed as the temperature of the epoxy surface.
    Temperature distribution varies on heating method, PCB material, other components in the assembly, and concentration of the parts mounted.
    Therefore, when an FR-4 PCB is mounted with one component, and heated via Far Infrared and Heated Air, the difference of temperature between PCB and device resin will be around 5 to 10. Please do not repeat the heating process in Reflow more than twice.

  2. 2.

    With regard to photodetectors, there is a possibility of an increase in dark current during reflow soldering after moisture absorption.
    Please take proper precautions for moisture control upon use and storage.
    Please refer to the moisture-proof packaging section for more details.

  3. 3.

    If soldering manually, Stanley recommends using a soldering iron with temperature control.
    During the actual soldering process, make sure that the soldering iron never touches the products (especially, the resin), and avoid the LED's electrode temperature reaching above the temperature of the solder pad.
    All repairs must be kept only once in the same spot, and please avoid reusing the detached products.

Soldering Through-hole Type Devices

  1. 1.

    Please avoid dipping the epoxy directly into the solder bath.

  2. 2.

    Please do not apply the heat of 100 on more to the resin.

  3. 3.

    It is not suitable for reflow soldering.

  4. 4.

    The tie-bar cutting part has oxidized because iron has been exposed, and the solderability might decreased to the tie-bar cutting part.
    Please use it after getting the solderability in the confirmation when the soldering part and the tie-bar cutting part overlap.

Soldering Requirement

The chart below represents the maximum ratings for soldering using typical lead free solder.
However, lowering the heating temperature and decreasing heating time is very effective in ensuring higher reliability.

Types Type of Product Manual Soldering Flow Soldering
(Dip Soldering)
Reflow Soldering
Surface Mount
Type
Lead-free
Soldering
Compatible
•Temperature at tip of iron
     350℃MAX.
•Soldering Time
      3s MAX.

[ LED ]
  Not
  Recommended

[ Photodetector ]
  Not
  Recommended
•Pre-heating
     150~180℃ 120s MAX.
•Operation heating
     230℃ 40s MAX.
•Peak temperature
     260℃
( Profile represents
the surface temperature of device )
Through-
hole Type
Lead-free
Soldering
Compatible
•Temperature at tip of iron
     360℃MAX.
•Soldering Time
     3s MAX.
•Position*
     At least
     3mm away
     from the root of lead
     (Some products
     may require
     only 1.6mm)
•Pre-heating
     100℃MAX.
•Bath temperature
     265℃MAX.
•Dipping time
     5s MAX.
•Position*
     At least
     3mm away
     from the root of lead
     (Some products
     may require
     only 1.6mm)
Not Recommended
Numeric
Display .
Light Bar
Module
Lead-free
Soldering
Compatible
•Temperature at tip of iron
     360℃MAX.
•Soldering Time
     3s MAX.
•Position*
     At least
     2mm away
     from the root of lead
•Pre-heating
     100℃MAX.
     60s MAX.
•Bath temperature
     265℃MAX.
•Dipping time
     5s MAX.
•Position*
     At least
     2mm away
     from the root of lead
Not Recommended
•The above table is typical of most parts. Recommended specification of some parts may be different from these, so please request the separate specification sheets to check the actual specifications for other parts.
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