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Handing Precautions
LED and Photodetector
  1. Basic Design
  1. Board Design
  1. Solder Paste
    (Surface Mount Type)
  1. Soldering Supply
    (Surface Mount Type)
  1. Mounting Using Automation
    (Surface Mount Type)
  1. Mounting handling of 1147LS, 1148LS and 1316LS types
    (Surface Mount Type)
  1. Mounting handling of 1142L⟨, 1145L⟨ and 1146BS types
    (Surface Mount Type)
  1. Handling of 1114C(K), 1105C(K) and 1148C Types.
    (Surface Mount Type)
  1. Lead Forming of The Through-hole Type Devices
  1. Mounting Through-hole Type Devices
  1. Soldering
  1. Cleaning
  1. Other
Moisture-proof Packaging of Surface Mount Type Device
InGaN Products
LED and Photodetector handing precautions

7. Mounting handling of 1142L⟨, 1145L⟨ and 1146BS types (Surface Mount Type)
<Recommended condition>
1. Picking up point with nozzle : Center of product form
Lamp housing strength decreases by about 50% if the picking up point is 0.5mm offset.
2. Load : Less than 10N ( Condition : Outside diameter of nozzle : φ1.1mm, Inside diameter : φ0.6mm)
Please adjust the load, picking up point and the nozzle diameter, etc. before mounting because the over load can cause the breakage of the lamp houseing.
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