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8. Handling of 1114C(K), 1105C(K) and 1148C Types. (Surface Mount Type)
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These types are designed chiefly for Cellular phone application, and are setting the thickness of the product to about 0.4-0.5 mm thinly.
To achieve the tin type of the product, making each material thin is aimed at. Because they are inferior to our general LEDs by an external stress, please use these product types after paying attention to the following.
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1.
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Please set the mounting load to Max. 2N.
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2.
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Please do not increase more quantity of the soldering paste than necessary quantity (The thickness of stencil Mask : about 100-120µ), because the terminal area of the product is small.
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3.
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Please avoid the collision of the mounting board etc. after LEDs were mounted on the substrate.
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4.
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When warp of substrate is large after these were mounted on FPC etc, please use these product types after affirming these is no problem.
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5.
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Please use these product types after affirming there is no problem about the mounting position etc. of product from substrate edge, when mounting them on multi-layer and multi-piece PCBs.
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