 |
13. Other
|
|
1.
|
Once the package is open, please use as soon as possible, as keeping an opened package for a long time could cause the lead or electrodes to oxidize.
With regard to handling the SMT, please refer to the Moisture-proof Packaging of SMT Products. For storage, please avoid wetness and humidity, while taking care to avoid condensation caused by sudden temperature changes.
|
|
2.
|
In case of product failures, the lot number on the product package label will help speed up disposal measures.
|
|
3.
|
When there is a process of supersonic wave welding etc. after mounting the product, there is a possibility of affecting on the reliability of junction part in package (junction part of die bonding and wire bonding).
Please use after affirming beforehand there is no problem.
|
|
4.
|
The following factors must be considered in designing the IRED and Photodetector. Please request all necessary specifications and technical data sheets from Stanley for verification.
|
•
|
Variation Factors : Radiation Level, Forward Voltage, Photo Current, Spatial Distribution, Mount Method, Material to be Detected, Transparency of background, Reflection Ratio.
|
|
•
|
Fluctuation Factors : Radiation Level, Forward Voltage, Photo Current, Temperature Characteristics of Dark Current, Fluctuation of Radiation Level/Photo Current/Dark Current from prolonged use, Random External Light, change of Material to be Detected, Power Voltage Fluctuation.
|
|
|
5.
|
Please contact Stanley with regard to the usage methods, taping specifications of through-hole type products, and packaging not listed on this home page.
|
|
6.
|
Information contained on this home page represents items listed on the specification sheet. Please contact Stanley to receive the most updated specifications of any part before use.
|
|
7.
|
Please contact your local Stanley representative for any other questions.
|
|
|
