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11. Soldering
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1.
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Heat stress during soldering will greatly influence the reliability of LEDs, however that effect will vary on heating method.
Also, if components of varying shape are soldered together, it is recommended to set the soldering pad temperature according to the component most vulnerable to heat (eg. surface mount type device).
(Recommended condition : Soldering pad temperature > Package temperature)
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2.
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Because LED parts including the epoxy are not stable immediately after soldering (when they are not at room temperature), any mechanical stress may cause damage to the product.
Please avoid such stress after soldering, especially stacking of the boards which may cause the boards to warp and any other types of friction with hard materials.
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3.
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During the soldering process with a soldering pad, if the pad has just been cleaned, please make sure the pad reaches appropriate temperature before resuming the solder process.
Also, please avoid pressure which could dislocate the components until the solder is cool and hard, as it may influence solder performance and quality.
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11-1. Soldering Surface Mount Type Device
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1.
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Recommended temperature profile for the Reflow soldering is listed as the temperature of the epoxy surface.
Temperature distribution varies on heating method, PCB material, other components in the assembly, and concentration of the parts mounted.
Therefore, when an FR-4 PCB is mounted with one component, and heated via Far Infrared and Heated Air, the difference of temperature between PCB and device resin will be around 5 to 10. Please do not repeat the heating process in Reflow more than twice.
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2.
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With regard to photodetectors, there is a possibility of an increase in dark current during reflow soldering after moisture absorption.
Please take proper precautions for moisture control upon use and storage. Please refer to the moisture-proof packaging section for more details.
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3.
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If soldering manually, Stanley recommends using a soldering iron with temperature control. During the actual soldering process, make sure that the soldering iron never touches the products (especially, the resin), and avoid the LED's electrode temperature reaching above the temperature of the solder pad.
All repairs must be kept only once in the same spot, and please avoid reusing the detached products.
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11-2. Soldering Through-hole Type Devices
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1.
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Please avoid dipping the epoxy directly into the solder bath.
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2.
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Please do not apply the heat of 100℃ on more to the resin.
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3.
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It is not suitable for reflow soldering.
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11-3. Soldering Requirement
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The chart below represents the maximum ratings for soldering using typical lead free solder.
However, lowering the heating temperature and decreasing heating time is very effective in ensuring higher reliability.
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| Types |
Type of Product |
Manual Soldering |
Flow Soldering (Dip Soldering) |
Reflow Soldering |
Surface
Mount
Type
 |
Lead-free
Soldering
Compatible
 |
•Temperature
at tip of iron
350 MAX.
( 30W MAX. )
•Soldering Time
3s MAX.
|
[ LED ]
Not
Recommended
[ Photodetector ]
Not
Recommended
|
•Pre-heating
150  180 120s MAX.
•Operation heating
Over 230 40s MAX.
•Peak temperature
260
( Profile represents the surface
temperature of device )
|
Through-
hole Type
 |
Lead-free
Soldering
Compatible
|
•Temperature
at tip of iron
400 MAX.
( 30W MAX. )
•Soldering Time
3s MAX.
•Position*
At least
3mm away
from the root of lead
(Some products
may require
only 1.6mm)
|
•Pre-heating
100 MAX.
•Bath temperature
265 MAX.
•Dipping time
5s MAX.
•Position*
At least
3mm away
from the root of lead
(Some products
may require
only 1.6mm)
|
Not Recommended
|
Numeric
Display .
Light Bar
Module
 |
Lead-free
Soldering
Compatible
|
•Temperature
at tip of iron
400 MAX.
( 30W MAX. )
•Soldering Time
3s MAX.
•Position*
At least
2mm away
from the root
of lead
|
•Pre-heating
100 MAX.
60s MAX.
•Bath temperature
265 MAX.
•Dipping time
5s MAX.
•Position*
At least
2mm away
from the root
of lead
|
Not Recommended
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•
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The above table is typical of most parts.
The recommended specification of some parts may be different from these, so please request the separate specification sheets to check the actual specifications for other parts.
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