Top > Search > Points of Note > LED and Photodetector Handling Precautions > 9. Lead Forming of The Through-hole Type Devices    
Handing Precautions
LED and Photodetector
  1. Basic Design
  1. Board Design
  1. Solder Paste
    (Surface Mount Type)
  1. Soldering Supply
    (Surface Mount Type)
  1. Mounting Using Automation
    (Surface Mount Type)
  1. Mounting handling of 1147LS, 1148LS and 1316LS types
    (Surface Mount Type)
  1. Mounting handling of 1142L⟨, 1145L⟨ and 1146BS types
    (Surface Mount Type)
  1. Handling of 1114C(K), 1105C(K) and 1148C Types.
    (Surface Mount Type)
  1. Lead Forming of The Through-hole Type Devices
  1. Mounting Through-hole Type Devices
  1. Soldering
  1. Cleaning
  1. Other
Moisture-proof Packaging of Surface Mount Type Device
InGaN Products
LED and Photodetector handing precautions

9. Lead Forming of The Through-hole Type Devices

1. The lead should be bent at a point 2mm away from the root of lead. Please avoid bending more than twice.

2. During forming, a jig or radio pliers should be firmly fixed to the root of lead, to which no mechanical stress should be applied.

3. Please avoid the tie-bar part of lead during forming because there is a possibility that the stable forming shape can not be formed.
(The tie-bar position is different accoding to the product, and affirm it beforehand, please.)

4. Forming pitch should be adjusted to the device insertion hole-pitch on the PCB.

5. All forming must be performed prior to soldering.

6. Avoid excessive stress to The lead when mounting.

Handing Precautions Top Back Next

Privacy policy