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Handing Precautions
LED and Photodetector
  1. Basic Design
  1. Board Design
  1. Solder Paste
    (Surface Mount Type)
  1. Soldering Supply
    (Surface Mount Type)
  1. Mounting Using Automation
    (Surface Mount Type)
  1. Mounting handling of 1147LS, 1148LS and 1316LS types
    (Surface Mount Type)
  1. Mounting handling of 1142L⟨, 1145L⟨ and 1146BS types
    (Surface Mount Type)
  1. Handling of 1114C(K), 1105C(K) and 1148C Types.
    (Surface Mount Type)
  1. Lead Forming of The Through-hole Type Devices
  1. Mounting Through-hole Type Devices
  1. Soldering
  1. Cleaning
  1. Other
Moisture-proof Packaging of Surface Mount Type Device
InGaN Products
LED and Photodetector handing precautions

4. Soldering Supply (Surface Mount Type)
Please use appropriate amount of solder on the soldering pad to prevent parts from shifting after they have been mounted. (Stanley recommends using a Screen Print method suited for fine pattern precision mounting.) The thickness of a Stencil Mask is fixed at 150200µm (1113F type : 120150µm ), and a urethane rubber spreader (stiffness-90) with a tip angle of 90° is recommended. Please adjust the speed so that the solder paste turns at a slow and constant pace at the spreader tip, and please operate in a temperature-controlled environment to avoid mounting variation.
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