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2. Board Design
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2-1. Board Design for Surface Mount Type
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| 1. |
Recommended pads are specified per product, however when designing the board, please take utmost care to prevent bridging or Tombstone (Manhattan) effect of the solder.
The pad in the back of the product of Right Angle Type (1101F) is a preliminary pad for the positional gap prevention and the mounting strength securing.
There is no problem in the product use even if this preliminary pad is not used.
If necessary, please use this preliminary pad for improvement of the stationary strength (increase by approx. 20%) and the product line level by using this preliminary pad.
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| 2. |
When mounting SMT on PCB, please make sure that the electrodes are aligned perpendicular to the PCB curve. Also, please note the mounting positions of the SMT from the board edge, routing lines, V-Cut depth etc. when mounting them onto multi-layer, multi-piece PCBs.
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2-2. Board Design for Through-hole Type
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| 1. |
Recommended diameter of board pitch is shown on the right.
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| 2. |
The positioning pitch on the board must be the same as the lead.
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| Lead Width |
Holes Between Pitch On Board |
| ¤0.4mm |
φ0.7mm 1.0mm |
| ¤0.5mm |
φ0.8mm1.0mm |
| ¤0.6mm |
φ1.0mm1.3mm |
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| 3. |
When using a direct mount type device, Stanley recommends using a one-sided board, or double-sided board that does not use a through-hole.
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| 4. |
When mounting flat-type packages, please align the leads so that they are perpendicular to the board curve. Please note the mounting positions of the component from the board edge, routing lines, V-Cut depth, etc. when mounting them onto multi-layer, multi-piece PCBs.
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